From March 13 (Wednesday) to 15 (Friday), 2024, Takaya Corporation’s presentation titled “The Latest Trends in Hybrid Inspection Systems Combining JTAG Testing and Flying Probe Testers,” delivered at the 38th Spring Conference of the Japan Institute of Electronics Packaging held at Tokyo University of Science, received the Excellence Award at the same conference.
The award ceremony was held on September 12, 2024, at Daido University in Aichi Prefecture during the “MES2024 Symposium,” where a commemorative plaque was presented.
Press release can be found here
Presentation materials from the event can be viewed here
